18774603. HYBRID PRINTED CIRCUIT BOARD (Samsung Electronics Co., Ltd.)
HYBRID PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Moonyoung Kim of Suwon-si (KR)
HYBRID PRINTED CIRCUIT BOARD
This abstract first appeared for US patent application 18774603 titled 'HYBRID PRINTED CIRCUIT BOARD
Original Abstract Submitted
A hybrid printed circuit board includes: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole configured to accommodate a surface mount device; and an adhesive member comprising an adhesive material provided between the insulating substrate and the printed circuit board.