Samsung electronics co., ltd. (20250089166). HYBRID PRINTED CIRCUIT BOARD
HYBRID PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Moonyoung Kim of Suwon-si (KR)
HYBRID PRINTED CIRCUIT BOARD
This abstract first appeared for US patent application 20250089166 titled 'HYBRID PRINTED CIRCUIT BOARD
Original Abstract Submitted
a hybrid printed circuit board includes: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole configured to accommodate a surface mount device; and an adhesive member comprising an adhesive material provided between the insulating substrate and the printed circuit board.