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Category:H03K19/173
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This category has the following 17 subcategories, out of 17 total.
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Pages in category "H03K19/173"
The following 43 pages are in this category, out of 43 total.
1
- 17812242. MULTIPLEXER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18074445. MODULAR SYSTEM (SWITCHBOARDS AND MID-PLANE) FOR SUPPORTING 50G OR 100G ETHERNET SPEEDS OF FPGA+SSD simplified abstract (Samsung Electronics Co., Ltd.)
- 18176121. POWER REDUCTION IN A CLOCK BUFFER OF A MEMORY MODULE BASED UPON MEMORY MODULE SPEED simplified abstract (Dell Products L.P.)
- 18340665. DATA RECEIVER CIRCUIT INCLUDING LOOP-UNROLLED PHASE DECISION FEEDBACK EQUALIZER WITH DUTY CYCLE CONTROL (QUALCOMM Incorporated)
- 18350512. DESIGN-FOR-TEST CIRCUITS AND METHODS OF OPERATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18420801. Operation stage of pipeline analog-to-digital converter (ADC) and multiplying circuit thereof simplified abstract (Realtek Semiconductor Corp.)
- 18455904. MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18501924. POWER CONVERTER WITH AUXILIARY INDUCTOR (TEXAS INSTRUMENTS INCORPORATED)
- 18618901. CLOUD-BASED SCALE-UP SYSTEM COMPOSITION simplified abstract (Intel Corporation)
- 18666135. IC WITH FIRST AND SECOND FUNCTIONAL CIRCUITS COUPLING ONLY FIRST CIRCUITS TO OUTPUT BOND PADS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18667059. High Speed Differential ROM simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18672339. DIE LOCATION DETECTION FOR GROUPED MEMORY DIES simplified abstract (Micron Technology, Inc.)
- 18814125. MEMORY DEVICE FOR PERFORMING IN-MEMORY PROCESSING (SAMSUNG ELECTRONICS CO., LTD.)
- 18937774. INPUT/OUTPUT INTERFACE CIRCUIT AND MEMORY SYSTEM INCLUDING THE SAME (Samsung Electronics Co., Ltd.)
- 18959128. BANK TO BANK DATA TRANSFER (Lodestar Licensing Group LLC)
- 19018549. SEMICONDUCTOR DEVICE (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
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- Micron technology, inc. (20240312499). DIE LOCATION DETECTION FOR GROUPED MEMORY DIES simplified abstract
- Micron technology, inc. (20240413840). ITERATIVE ERROR CORRECTION IN MEMORY SYSTEMS
- Micron Technology, Inc. patent applications on December 12th, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
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- Samsung electronics co., ltd. (20240419445). MEMORY DEVICE FOR PERFORMING IN-MEMORY PROCESSING
- Samsung electronics co., ltd. (20250062752). TEST APPARATUS AND TEST METHOD FOR DETECTING DEFECTS OF ELEMENTS INCLUDED IN INTEGRATED CIRCUIT
- Samsung electronics co., ltd. (20250149077). INPUT/OUTPUT INTERFACE CIRCUIT AND MEMORY SYSTEM INCLUDING THE SAME
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Semiconductor energy laboratory co., ltd. (20250150083). SEMICONDUCTOR DEVICE
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. patent applications on May 8th, 2025
- Sk hynix inc. (20240243747). CLOCK MULTIPLEXING CIRCUIT, CLOCK DISTRIBUTION CIRCUIT, AND SEMICONDUCTOR APPARATUS INCLUDING THE CLOCK MULTIPLEXING CIRCUIT simplified abstract
- SK hynix Inc. patent applications on July 18th, 2024