Micron technology, inc. (20240312499). DIE LOCATION DETECTION FOR GROUPED MEMORY DIES simplified abstract
DIE LOCATION DETECTION FOR GROUPED MEMORY DIES
Organization Name
Inventor(s)
Kang-Yong Kim of Boise ID (US)
DIE LOCATION DETECTION FOR GROUPED MEMORY DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312499 titled 'DIE LOCATION DETECTION FOR GROUPED MEMORY DIES
The patent application focuses on detecting the location of grouped memory dies in a memory device, allowing for individual access despite being coupled with a shared bus.
- Memory device includes multiple memory dies coupled with a shared bus.
- Each memory die has a circuit to output an identifier associated with its location.
- Identifying the locations of memory dies enables individual access despite sharing a bus.
Potential Applications: - Data centers - High-performance computing - Embedded systems
Problems Solved: - Efficient memory access in systems with multiple memory dies - Simplified memory management
Benefits: - Improved system performance - Enhanced memory reliability - Simplified memory addressing
Commercial Applications: Title: "Advanced Memory Management Technology for Enhanced System Performance" This technology can be utilized in servers, supercomputers, and IoT devices to optimize memory access and enhance overall system performance.
Prior Art: Researchers can explore existing patents related to memory management, die location detection, and shared bus communication in memory devices.
Frequently Updated Research: Stay updated on advancements in memory management technologies, die location detection methods, and shared bus communication protocols to enhance system performance and reliability.
Questions about Memory Die Location Detection: 1. How does identifying the locations of memory dies improve system performance? - Identifying memory die locations allows for efficient memory access and management, reducing latency and improving overall system performance.
2. What are the potential challenges in implementing memory die location detection in memory devices? - Challenges may include signal interference, power consumption, and compatibility with existing memory architectures.
Original Abstract Submitted
the subject application is directed to die location detection for grouped memory dies are described. a memory device may include multiple memory die that are coupled with a shared bus. in some examples, each memory die may include a circuit configured to output an identifier associated with a location of the respective memory die. for example, a first memory die may output a first identifier, based on receiving one or more signals, that identifies a location of the first memory die. identifying the locations of the respective memory dies may allow for the dies to be individually accessed despite being coupled with a shared bus.
