18672339. DIE LOCATION DETECTION FOR GROUPED MEMORY DIES simplified abstract (Micron Technology, Inc.)
DIE LOCATION DETECTION FOR GROUPED MEMORY DIES
Organization Name
Inventor(s)
Kang-Yong Kim of Boise ID (US)
DIE LOCATION DETECTION FOR GROUPED MEMORY DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18672339 titled 'DIE LOCATION DETECTION FOR GROUPED MEMORY DIES
The subject application focuses on detecting the location of grouped memory dies within a memory device, allowing for individual access despite being connected to a shared bus.
- Memory device includes multiple memory dies coupled with a shared bus.
- Each memory die has a circuit that outputs an identifier indicating its location.
- Identifying the locations of memory dies enables individual access despite sharing a bus.
Potential Applications: - Data centers - Embedded systems - Mobile devices
Problems Solved: - Efficient memory access in systems with multiple memory dies - Simplified memory management
Benefits: - Improved system performance - Enhanced data retrieval speed - Better memory utilization
Commercial Applications: Title: "Enhanced Memory Management Technology for Improved System Performance" This technology can be utilized in various industries such as data centers, IoT devices, and mobile phones to optimize memory access and enhance overall system performance.
Questions about Memory Die Location Detection: 1. How does identifying the locations of memory dies improve system performance?
- By allowing for individual access, the system can retrieve data more efficiently, leading to improved performance.
2. What are the potential drawbacks of using shared buses in memory devices?
- Shared buses can lead to congestion and slower data transfer speeds, impacting overall system performance.
Original Abstract Submitted
The subject application is directed to die location detection for grouped memory dies are described. A memory device may include multiple memory die that are coupled with a shared bus. In some examples, each memory die may include a circuit configured to output an identifier associated with a location of the respective memory die. For example, a first memory die may output a first identifier, based on receiving one or more signals, that identifies a location of the first memory die. Identifying the locations of the respective memory dies may allow for the dies to be individually accessed despite being coupled with a shared bus.
