There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01L21/321
Jump to navigation
Jump to search
Subcategories
This category has the following 25 subcategories, out of 25 total.
A
B
C
F
H
J
K
M
S
T
W
X
Y
Z
Pages in category "H01L21/321"
The following 137 pages are in this category, out of 137 total.
1
- 17446405. RESISTOR WITHIN A VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17739783. Semiconductor Device and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836579. CAPACITOR STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17945422. MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET simplified abstract (International Business Machines Corporation)
- 18091026. ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract (Intel Corporation)
- 18091188. ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract (Intel Corporation)
- 18112564. Layered Substrate with Ruthenium Layer and Method for Producing simplified abstract (Applied Materials, Inc.)
- 18152539. Fan-Out Stacked Package and Methods of Making the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18157906. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18166403. SELF-ALIGNED SMALL CONTACT STRUCTURE simplified abstract (QUALCOMM Incorporated)
- 18185849. METHOD FOR DETECTION OF WAFER SLIPPAGE simplified abstract (Applied Materials, Inc.)
- 18209700. NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION (Applied Materials, Inc.)
- 18334955. RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18353293. SUBSTRATE PROCESSING DEVICE AND METHOD FOR OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18411986. COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS simplified abstract (ENTEGRIS, INC.)
- 18415086. RESISTOR WITHIN A VIA simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18432694. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18436499. DEFORMABLE SUBSTRATE CHUCK simplified abstract (Applied Materials, Inc.)
- 18437058. METHODS, SYSTEMS, AND APPARATUS FOR CONDUCTING A RADICAL TREATMENT OPERATION PRIOR TO CONDUCTING AN ANNEALING OPERATION simplified abstract (Applied Materials, Inc.)
- 18451824. Display Apparatus simplified abstract (LG Display Co., Ltd.)
- 18504415. DC Bias in Plasma Process simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18523457. METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18527151. SEMICONDUCTOR DEVICE HAVING METAL GATE AND POLY GATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18537574. METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18542093. SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING LAYER DURING POLISHING simplified abstract (Applied Materials, Inc.)
- 18569943. POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD simplified abstract (Resonac Corporation)
- 18581162. CONTACT FORMATION METHOD AND RELATED STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18586425. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18601433. VIA CONNECTION TO A PARTIALLY FILLED TRENCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602665. VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18603614. CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18609533. CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18609795. SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18610982. METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18616449. SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18623285. Gate-All-Around Device with Protective Dielectric Layer and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18650668. FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667585. CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669102. CHEMICAL MECHANICAL POLISHING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18670557. SEMICONDUCTOR DEVICE WITH METAL CAP ON GATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18731590. BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18761170. POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Samsung Electronics Co., Ltd.)
- 18974261. Source/Drain Contact Structure (Taiwan Semiconductor Manufacturing Co., Ltd.)
2
- 20240038527. FORMING FILMS WITH IMPROVED FILM QUALITY simplified abstract (Applied Materials, Inc.)
- 20240043720. POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SUBSTRATE simplified abstract (FUJIMI INCORPORATED)
- 20240055487. SILICON CARBIDE SUBSTRATE OR SUBSTRATE PROCESSING METHOD simplified abstract (National Central University)
A
- Applied materials, inc. (20240282709). Layered Substrate with Ruthenium Layer and Method for Producing simplified abstract
- Applied materials, inc. (20240420952). NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Applied materials, inc. (20250001547). FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Applied materials, inc. (20250006518). BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on January 2nd, 2025
B
I
- Intel corporation (20240222130). ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract
- Intel corporation (20240222136). ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract
- Intel corporation (20240413016). TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on July 4th, 2024
- International business machines corporation (20240096887). MULTI-VT SOLUTION FOR REPLACEMENT METAL GATE BONDED STACKED FET simplified abstract
- International Business Machines Corporation patent applications on March 21st, 2024
K
L
Q
S
- Samsung electronics co., ltd. (20240234164). SUBSTRATE PROCESSING DEVICE AND METHOD FOR OPERATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240318037). SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240318038). METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240318039). CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240318040). CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250011624). POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096642). METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096643). SEMICONDUCTOR DEVICE HAVING METAL GATE AND POLY GATE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096722). Fan-Out Stacked Package and Methods of Making the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162145). RESISTOR WITHIN A VIA simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186148). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194520). CONTACT FORMATION METHOD AND RELATED STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250020). VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250142). Gate-All-Around Device with Protective Dielectric Layer and Method of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240308021). CHEMICAL MECHANICAL POLISHING METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240313115). SEMICONDUCTOR DEVICE WITH METAL CAP ON GATE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240327677). CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240420978). RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Taiwan semiconductor manufacturing co., ltd. (20250107196). Source/Drain Contact Structure
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 30th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240178300). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240203750). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213034). VIA CONNECTION TO A PARTIALLY FILLED TRENCH simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234549). SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282641). FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304455). CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321746). BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379358). METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379378). Metal Contacts on Metal Gates and Methods Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379595). SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379775). PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413020). Contact Plugs With Reduced R/C and the Methods of Forming The Same
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Tokyo electron limited (20240243006). SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES simplified abstract
- Tokyo Electron Limited patent applications on July 18th, 2024
- Tokyo Electron Limited patent applications on March 6th, 2025
U
- US Patent Application 17828802. METHOD OF PREPARING ACTIVE AREAS simplified abstract
- US Patent Application 18100937. POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract
- US Patent Application 18358557. Resistor Structure simplified abstract
- US Patent Application 18359180. Novel CMP Pad Design and Method of Using the Same simplified abstract
- US Patent Application 18359364. Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture simplified abstract
- US Patent Application 18359486. Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices simplified abstract
- US Patent Application 18359747. REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18361262. PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS simplified abstract
- US Patent Application 18363217. FERROELECTRIC MFM CAPACITOR ARRAY AND METHODS OF MAKING THE SAME simplified abstract
- US Patent Application 18365405. Local Gate Height Tuning by CMP and Dummy Gate Design simplified abstract
- US Patent Application 18447084. IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE simplified abstract
