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Category:CPC H01L23/576
Pages in category "CPC H01L23/576"
The following 23 pages are in this category, out of 23 total.
A
- Advanced micro devices, inc. (20250132270). CHIP PACKAGE WITH TAMPER PREVENTION
- Advanced Micro Devices, Inc. patent applications on April 24th, 2025
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on March 6th, 2025
- Arm Limited Patent Application Trends in 2025
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- Nvidia corporation (20250079344). SECURITY CHIP FOR ENSURING THE PHYSICAL INTEGRITY OF AN INTEGRATED CIRCUIT
- NVIDIA Corporation Patent Application Trends in 2025
- Nvidia corporation Patent Application Trends in 2025
- Nvidia Corporation Patent Application Trends in 2025
- NVIDIA Corporation patent applications on March 6th, 2025
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- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240413100). STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025