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Category:CPC H01L23/5256
Pages in category "CPC H01L23/5256"
The following 41 pages are in this category, out of 41 total.
1
- 18333189. SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18470655. BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470664. BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18482213. ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18753168. INTEGRATED CIRCUIT INCLUDING ELECTRONIC FUSE BIT CELL (SAMSUNG ELECTRONICS CO., LTD.)
- 18958537. FAIL-OPEN ISOLATOR (TEXAS INSTRUMENTS INCORPORATED)
- 18991798. SEMICONDUCTOR STRUCTURE HAVING FUSE BELOW GATE STRUCTURE AND METHOD OF MANUFACTURING THEREOF (NANYA TECHNOLOGY CORPORATION)
- 19001619. METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE (NANYA TECHNOLOGY CORPORATION)
- 19004494. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
2
A
I
- International business machines corporation (20250096126). BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- International business machines corporation (20250096127). BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- International business machines corporation (20250118660). ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK
- International Business Machines Corporation Patent Application Trends in 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on April 10th, 2025
- International Business Machines Corporation patent applications on February 20th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 20th, 2025
N
- Nanya technology corporation (20250125257). SEMICONDUCTOR STRUCTURE HAVING FUSE BELOW GATE STRUCTURE AND METHOD OF MANUFACTURING THEREOF
- Nanya technology corporation (20250125258). METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE
- NANYA TECHNOLOGY CORPORATION patent applications on April 17th, 2025
S
- Samsung electronics co., ltd. (20250070019). INTEGRATED CIRCUIT INCLUDING ELECTRONIC FUSE BIT CELL
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
T
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240297115). SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICATING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Texas instruments incorporated (20250087583). FAIL-OPEN ISOLATOR
- TEXAS INSTRUMENTS INCORPORATED patent applications on March 13th, 2025