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Category:CPC H01L23/4951
Pages in category "CPC H01L23/4951"
The following 24 pages are in this category, out of 24 total.
1
- 18426032. SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18478715. WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE (TEXAS INSTRUMENTS INCORPORATED)
- 18823912. POWER SEMICONDUCTOR DEVICE HAVING A SOLDER BLEED OUT PREVENTION LAYER AND METHOD FOR FABRICATING THE SAME (Infineon Technologies AG)
- 18990219. POWER MODULE AND RELATED METHODS (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024