SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

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SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 18426032 titled 'SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

The method described in the patent application involves connecting semiconductor elements to conductive plates on insulating substrates, which are then placed on a metal base. A case with lead frames is attached to the base, with the lead frames overlapping and molded together. Insulating members are attached to sandwich the wiring parts of the lead frames, filling any gaps before joining them to circuit patterns.

Electrically connecting semiconductor elements to conductive plates on insulating substrates
Attaching a case with lead frames to a metal base
Integrally molding lead frames with overlapping wiring parts
Attaching insulating members to sandwich and fill gaps in wiring parts
Joining lead frames to circuit patterns after insulating members are attached

Potential Applications: - Semiconductor manufacturing - Electronics assembly - Circuit board production

Problems Solved: - Efficient and secure connection of semiconductor elements - Simplified assembly process - Improved insulation and gap filling

Benefits: - Enhanced electrical connectivity - Streamlined manufacturing process - Increased reliability and durability of electronic components

Commercial Applications: Title: Advanced Semiconductor Assembly Method for Electronics Industry This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and automotive electronics. It can improve the efficiency and quality of semiconductor assembly processes, leading to more reliable and durable electronic products.

Questions about the technology: 1. How does this method improve the reliability of electronic components? 2. What are the potential cost savings associated with using this assembly method?

Original Abstract Submitted

A method includes electrically connecting first and second semiconductor elements to conductive plates, respectively, on the front surface of one or more insulating substrates disposed on a metal base; disposing, on the base, a case including a chassis, a first lead frame having a first wiring part extending in a wired direction parallel to the front surface, and a second lead frame having a second wiring part in the wiring direction to overlap the first wiring part with gap that are integrally molded together; and attaching one or more insulating members that include a clamping part sandwiching the first and second wiring parts from the rear surface of the first wiring part and the front surface of the second wiring part in an attachment area thereof and a wiring gap part filling the gap in the attachment area, before joining the lead frames to circuit patterns, respectively.