MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT

Abstract: a semiconductor package is configured for electrically connecting an external component to a top surface of the semiconductor package. the semiconductor package includes a raised connector that extends from a lead frame portion, vertically through encapsulation material, and is exposed at the top surface. a semiconductor component is electrically connected to the lead frame portion. the raised connector includes a vertical column and a horizontal pad, contiguous with each other. the raised connector has a continuous core, which is electrically conductive, extending throughout the vertical column and throughout the horizontal pad. the vertical column is attached to the lead frame portion. a top surface of the horizontal pad is exposed at a top surface of the encapsulation material. the raised connector may include two or more vertical columns. the semiconductor package may include two or more raised connectors, each attached to the lead frame portion.

Inventor(s): John Carlo C Molina, Charmaine Grace Facal, Lorraine D Quijano

CPC Classification: H01L23/4951 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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