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Category:CPC H01L23/3114
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Pages in category "CPC H01L23/3114"
The following 48 pages are in this category, out of 48 total.
1
- 18090273. DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18398680. SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES simplified abstract (ROHM CO., LTD.)
- 18587331. FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract (Intel Corporation)
- 18652779. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18679091. PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18892965. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18945476. SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A PASSIVATION LAYER (Taiwan Semiconductor Manufacturing Company, LTD.)
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250014958). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250105077). PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240258185). WARPAGE CONTROL OF PACKAGES USING EMBEDDED CORE FRAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282653). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321661). PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062173). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Taiwan semiconductor manufacturing company, ltd. (20250069975). SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A PASSIVATION LAYER
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
