PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Shin-Puu Jeng of Hsinchu TW

Hsien-Wen Liu of Hsinchu City TW

Shih-Ting Hung of New Taipei City TW

Yi-Jou Lin of Hsinchu City TW

Tzu-Jui Fang of Hsinchu TW

Po-Yao Chuang of Hsin-Chu TW

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 20250105077 titled 'PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

a package-on-package (pop) structure includes a first package structure and a second package structure stacked on the first package structure. the first package structure includes a die, conductive structures, an encapsulant, and a conductive pattern layer. the conductive structures surround the die. the encapsulant laterally encapsulates the die and the conductive structures. the conductive pattern layer is disposed over and in physical contact with a top surface of the encapsulant and top surfaces of the conductive structures. an entire bottom surface of the conductive pattern layer is located at a same level height, and an entirety of the top surface of the encapsulant and an entirety of the top surfaces of the conductive structures are located at the same level height.