Taiwan semiconductor manufacturing company, ltd. (20250062173). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chien-Hsun Lee of Chu-tung Town (TW)
Jiun Yi Wu of Zhongli City (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
This abstract first appeared for US patent application 20250062173 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Original Abstract Submitted
an integrated fan out package is utilized in which the dielectric materials of different redistribution layers are utilized to integrate the integrated fan out package process flows with other package applications. in some embodiments an ajinomoto or prepreg material is utilized as the dielectric in at least some of the overlying redistribution layers.