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Category:B81B7/02
Subcategories
This category has the following 15 subcategories, out of 15 total.
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Pages in category "B81B7/02"
The following 34 pages are in this category, out of 34 total.
1
- 18179609. INERTIAL MEASUREMENT UNIT (IMU) WITH BLENDING OF OUTPUTS FROM AN ARRAY OF MICRO-ELECTROMECHANICAL SYSTEM (MEMS) SENSORS simplified abstract (Honeywell International Inc.)
- 18273735. MULTIPLE-FREQUENCY-COMPONENT SCANNING INVOLVING SCAN-PATTERN DESIGN AND BALANCED OR OPTIMIZED ATTRIBUTES simplified abstract (THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY)
- 18525319. MICROMECHANICAL Z-ACCELERATION SENSOR WITH REFERENCE ELECTRODE simplified abstract (Robert Bosch GmbH)
- 18599907. MICROMIRROR CHIP PACKAGE STRUCTURE, LASER DEVICE, AND VEHICLE simplified abstract (Huawei Technologies Co., Ltd.)
- 18760470. SENSOR (Kabushiki Kaisha Toshiba)
- 18909623. THERMAL EMITTER, METHOD FOR OPERATING A THERMAL EMITTER AND MEMS GAS/FLUID SENSOR (Infineon Technologies AG)
- 18918159. CIRCUIT FOR OPERATING A CAPACITIVE SENSOR AND SENSOR APPARATUS (Robert Bosch GmbH)
- 18933364. PRESSURE TRANSDUCERS HAVING IMPROVED RESISTANCE TO TEMPERATURE ERROR (Illinois Tool Works Inc.)
- 18936352. SENSOR MODULE AND MANUFACTURING METHOD OF THE SAME (Electronics and Telecommunications Research Institute)
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- Honeywell international inc. (20240302169). INERTIAL MEASUREMENT UNIT (IMU) WITH BLENDING OF OUTPUTS FROM AN ARRAY OF MICRO-ELECTROMECHANICAL SYSTEM (MEMS) SENSORS simplified abstract
- Honeywell International Inc. patent applications on February 6th, 2025
- Honeywell International Inc. patent applications on September 12th, 2024
- Huawei technologies co., ltd. (20240208803). MICROMIRROR CHIP PACKAGE STRUCTURE, LASER DEVICE, AND VEHICLE simplified abstract
- Huawei Technologies Co., Ltd. patent applications on January 18th, 2024
- Huawei Technologies Co., Ltd. patent applications on June 27th, 2024
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- Stmicroelectronics international n.v. (20250002332). MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION OF PRESSURE AND INERTIAL DETECTION STRUCTURES AND CORRESPONDING MANUFACTURING PROCESS
- Stmicroelectronics international n.v. (20250002333). WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
- STMicroelectronics International N.V. patent applications on January 2nd, 2025