Category:Joan Rey Villarba Buot of Escondido CA (US)
Joan Rey Villarba Buot
Joan Rey Villarba Buot from Escondido CA (US) has applied for patents in technology areas such as H01L23/498, H01L23/00, H01L23/538 with qualcomm incorporated.
Patents
Pages in category "Joan Rey Villarba Buot of Escondido CA (US)"
The following 25 pages are in this category, out of 25 total.
1
- 17455576. RECESS STRUCTURE FOR PADLESS STACK VIA simplified abstract (QUALCOMM Incorporated)
- 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17879594. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
- 18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18158225. EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18189991. PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract (QUALCOMM Incorporated)
- 18190019. PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18455439. DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDDED THEREIN (QUALCOMM Incorporated)
- 18455928. PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE (QUALCOMM Incorporated)
- 18817038. INKJET PRINTING DEDICATED TEST PINS (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20240105568). PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS simplified abstract
- Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240194545). METAL POCKET FANOUT PACKAGE simplified abstract
- Qualcomm incorporated (20240250009). EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240274516). INTERPOSER WITH SOLDER RESIST POSTS simplified abstract
- Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20240321763). PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract
- Qualcomm incorporated (20240413137). INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL INTERCONNECTS THERMALLY COUPLING A DIE TO AN INTERPOSER SUBSTRATE FOR DISSIPATING THERMAL ENERGY OF THE DIE, AND RELATED FABRICATION METHODS
- Qualcomm incorporated (20240421105). INKJET PRINTING DEDICATED TEST PINS
- Qualcomm incorporated (20250062203). SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A CORE LAYER AND AN ADJACENT INSULATION LAYER(S) WITH AN EMBEDDED METAL STRUCTURE(S) POSITIONED FROM THE CORE LAYER
- Qualcomm incorporated (20250062235). PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- Qualcomm incorporated (20250062246). STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE
- Qualcomm incorporated (20250070001). DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDDED THEREIN
- Qualcomm incorporated (20250070086). PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE