18455928. PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE (QUALCOMM Incorporated)
PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE
Organization Name
Inventor(s)
Aniket Patil of San Diego CA (US)
Joan Rey Villarba Buot of Escondido CA (US)
Michelle Yejin Kim of Carlsbad CA (US)
Manuel Aldrete of Encinitas CA (US)
PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE
This abstract first appeared for US patent application 18455928 titled 'PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE
Original Abstract Submitted
A device includes a bottom substrate including first conductors, a top substrate including second conductors, and a first die disposed between the bottom substrate and the top substrate. The first die includes circuitry and first contacts electrically connected to the circuitry and to the first conductors. The device also includes a redistribution die disposed between the bottom substrate and the top substrate adjacent to the first die. The redistribution die includes second contacts electrically connected to the first contacts through the first conductors and third contacts electrically connected to the second conductors. The redistribution die also includes redistribution traces electrically connected to the second contacts and to the third contacts. The top substrate includes fourth contacts electrically connected through the second conductors to the third contacts to define one or more signal paths between the fourth contacts and the first die.