18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
METAL POCKET FANOUT PACKAGE
Organization Name
Inventor(s)
Hong Bok We of San Diego CA (US)
Joan Rey Villarba Buot of Escondido CA (US)
Sang-Jae Lee of San Diego CA (US)
Zhijie Wang of San Diego CA (US)
METAL POCKET FANOUT PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18063384 titled 'METAL POCKET FANOUT PACKAGE
The patent application describes die packages that utilize metal frames with metal pockets to house one or more dies, reducing warpage and allowing for the fabrication of packages with thin dies. The metal frame also acts as an electrical shield to protect the dies.
- Metal frames with metal pockets for die packages
- Reduction or elimination of warpage
- Fabrication of packages with thin dies
- Electrical conductivity of metal frame for use as an electrical shield
Potential Applications
The technology can be applied in the semiconductor industry for the manufacturing of electronic devices, such as integrated circuits and microprocessors.
Problems Solved
The technology addresses the issue of warpage in die packages, which can affect the performance and reliability of electronic devices.
Benefits
- Improved structural integrity - Enhanced protection for dies - Fabrication of packages with thin dies - Reduced warpage in die packages
Commercial Applications
The technology can be utilized in the production of various electronic devices, including smartphones, tablets, and computers, to enhance their performance and reliability.
Prior Art
Prior research in the field of semiconductor packaging and die mounting techniques may provide insights into similar approaches using metal frames and pockets.
Frequently Updated Research
Ongoing research in semiconductor packaging and materials science may lead to advancements in die package design and fabrication techniques.
Questions about Metal Frame Die Packages
How does the metal frame improve the structural integrity of die packages?
The metal frame provides support and stability to the package, reducing warpage and ensuring the proper alignment of the dies.
What are the potential challenges in implementing metal frame die packages in mass production?
Challenges may include the cost of materials, compatibility with existing manufacturing processes, and ensuring consistent quality control throughout production.
Original Abstract Submitted
Disclosed are examples of die packages that incorporate metal frames with metal pockets. One or more dies may be placed within the metal pockets. Due to the structural integrity provided by the metal frame, warpage is reduced or eliminated. As a result, die packages with thin dies may be fabricated. Further, due to the electrical conductivity provided by the metal frame, the metal frame may be used as an electrical shield to protect the dies.
