Qualcomm incorporated (20240274516). INTERPOSER WITH SOLDER RESIST POSTS simplified abstract
INTERPOSER WITH SOLDER RESIST POSTS
Organization Name
Inventor(s)
Joan Rey Villarba Buot of Escondido CA (US)
Zhijie Wang of San Diego CA (US)
Hong Bok We of San Diego CA (US)
Sang-Jae Lee of San Diego CA (US)
INTERPOSER WITH SOLDER RESIST POSTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274516 titled 'INTERPOSER WITH SOLDER RESIST POSTS
The patent application describes apparatuses and methods for fabricating the apparatuses, including an interposer with metal layers, vias, and solder resist posts, a package substrate, a die, and a thermal interface material (TIM).
- An interposer with metal layers, vias, and solder resist posts
- Package substrate
- Die electrically coupled to the package substrate
- Thermal interface material (TIM) on the die
- TIM thermally coupled the die and the second metal layer
Potential Applications: - Semiconductor packaging - Electronics manufacturing - Thermal management systems
Problems Solved: - Improved thermal conductivity - Enhanced electrical coupling - Efficient heat dissipation
Benefits: - Increased performance of electronic devices - Enhanced reliability - Better thermal management
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be used in the production of high-performance electronic devices, such as smartphones, computers, and servers, to improve their overall efficiency and reliability.
Prior Art: Readers can explore prior art related to semiconductor packaging, interposers, and thermal interface materials in the field of electronics manufacturing.
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the thermal management and performance of electronic devices.
Questions about Advanced Semiconductor Packaging Technology: 1. How does this technology compare to traditional semiconductor packaging methods? This technology offers improved thermal conductivity and enhanced electrical coupling compared to traditional methods, leading to better performance and reliability. 2. What are the potential cost implications of implementing this advanced packaging technology? Implementing this technology may initially incur higher costs due to the use of specialized materials and processes, but the long-term benefits in terms of performance and reliability outweigh the initial investment.
Original Abstract Submitted
disclosed are apparatuses and methods for fabricating the apparatuses. in an aspect, an apparatus may include: an interposer including a first metal layer, a second metal layer, a plurality of vias configured to thermally and electrically couple the first metal layer and the second metal layer, and a plurality of solder resist posts disposed on a bottom surface portion of the second metal layer; a package substrate; a die electrically coupled to the package substrate; and a thermal interface material (tim) disposed on the die, where the tim is configured to thermally coupled the die and the bottom surface portion of the second metal layer.
