Category:Jeremy D. ECTON of Gilbert AZ US
Jeremy D. ECTON
Jeremy D. ECTON from Gilbert AZ US has applied for patents in technology areas such as [[:Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })|the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]] with Intel Corporation.
Patents
[[Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]]
Pages in category "Jeremy D. ECTON of Gilbert AZ US"
The following 7 pages are in this category, out of 7 total.
2
- 20250183179. Passive Structures Embedd (Intel)
- 20250183180. Direct Bonding Embedded (Intel)
- 20250218898. Reconstituted Passive M (Intel)
- 20250218952. Spacer Embedded Componen (Intel)
- 20250218965. Self Alignment Structures Fo (Intel)
- 20250218998. Low Temperature Solder Inter (Intel)
- 20250219040. Technologies Components (Intel)