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Category:CPC H01L28/91
Pages in category "CPC H01L28/91"
The following 69 pages are in this category, out of 69 total.
1
- 18153831. CAPACITOR AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18184999. Treatment of Electrodes of MIM Capacitors simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18188082. STRUCTURE AND METHOD FOR DEEP TRENCH CAPACITOR simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18320020. DEEP TRENCH CAPACITORS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18330531. CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREASE CAPACITANCE DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation)
- 18367090. CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18388992. CAPACITOR COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18417150. CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18463231. CAPACITOR simplified abstract (Kabushiki Kaisha Toshiba)
- 18463231. CAPACITOR simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18614450. INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBERANCE, AND CORRESPONDING METHOD simplified abstract (Murata Manufacturing Co., Ltd.)
- 18614757. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SK Hynix Inc.)
- 18754706. BACKSIDE CAPACITOR TECHNIQUES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
F
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- IMEC VZW Patent Application Trends in 2024
- Intel corporation (20240413194). THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
- Intel corporation (20250006781). CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- International Business Machines Corporation Patent Application Trends in 2025
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240234488). CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240304663). CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- STMicroelectronics (Tours) SAS Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240313044). Treatment of Electrodes of MIM Capacitors simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240234487). DEEP TRENCH CAPACITORS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243165). CAPACITOR AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304662). CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREASE CAPACITANCE DENSITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321944). STRUCTURE AND METHOD FOR DEEP TRENCH CAPACITOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347582). BACKSIDE CAPACITOR TECHNIQUES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379738). STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAPACITOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250063743). IN-TRENCH CAPACITOR MERGED STRUCTURE
- Taiwan semiconductor manufacturing company, ltd. (20250063744). TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024