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Category:CPC H01L23/49513
Pages in category "CPC H01L23/49513"
The following 38 pages are in this category, out of 38 total.
1
- 18047670. SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18186202. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18211455. SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING (Intel Corporation)
- 18374573. IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES (INTEL CORPORATION)
- 18649331. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18910661. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE (STMicroelectronics International N.V.)
2
I
- Intel corporation (20240332134). METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240421043). SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING
- Intel corporation (20250112127). IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on October 3rd, 2024
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- Taiwan semiconductor manufacturing company, ltd. (20240321694). SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379505). Bond Films for Reduced Thermal Resistance and Methods Forming the Same simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024