ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Abstract: an electronic device a of the present disclosure includes an electronic component , a support member (die pad portion of a lead frame ) including a mount surface (obverse surface ) carrying the electronic component , and a bonding material provided between the electronic component and the support member (die pad portion ) for fixing the electronic component to the support member (die pad portion ). the mount surface (obverse surface ) includes a first region where a plurality of grooves are formed and a second region that surrounds the first region as viewed in the z direction. the bonding material is in contact with the first region , and is not in contact with the second region . this configuration serves to achieve an improvement in the reliability of the electronic device.

Inventor(s): Kazunori FUJI

CPC Classification: H01L23/49513 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

Search for rejections for patent application number 20250183125