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Category:Robert L. Sankman of Phoenix AZ (US)
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Pages in category "Robert L. Sankman of Phoenix AZ (US)"
The following 8 pages are in this category, out of 8 total.
1
- 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)
- 18244689. PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES simplified abstract (Intel Corporation)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation)
- 18392368. EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING simplified abstract (Intel Corporation)
- 18397891. MULTI-CHIP PACKAGING simplified abstract (Intel Corporation)
- 18516579. SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTURE AND METHOD OF MAKING simplified abstract (Intel Corporation)
