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Category:Kunal R. Parekh of Boise ID (US)
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Pages in category "Kunal R. Parekh of Boise ID (US)"
The following 10 pages are in this category, out of 10 total.
1
- 17821676. MEMORY WITH PARALLEL MAIN AND TEST INTERFACES simplified abstract (Micron Technology, Inc.)
- 17884475. SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)
- 18315311. INTERFACES BETWEEN HIGHER VOLTAGE AND LOWER VOLTAGE WAFERS AND RELATED APPARATUSES AND METHODS simplified abstract (Micron Technology, Inc.)
- 18478031. MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18491711. MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18507721. FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
