18237259. SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS simplified abstract (Micron Technology, Inc.)
SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS
Organization Name
Inventor(s)
Kyle K. Kirby of Eagle ID (US)
Kunal R. Parekh of Boise ID (US)
SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18237259 titled 'SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS
Simplified Explanation
- Explanation:**
A semiconductor assembly is described in which two semiconductor dies are connected through an interconnect. The dies each have a layer of dielectric material with conductive material implementing portions of a passive circuit component. A metal-metal bond is formed between the portions to create the passive circuit component.
- Potential Applications:**
1. Integrated circuits 2. Electronic devices 3. Communication systems
- Problems Solved:**
1. Improving connectivity between semiconductor dies 2. Enhancing performance of passive circuit components 3. Increasing efficiency of semiconductor assemblies
- Benefits:**
1. Enhanced functionality of electronic devices 2. Improved reliability of integrated circuits 3. Increased performance of communication systems
Original Abstract Submitted
A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first layer of dielectric material at which a first portion of conductive material implementing a first portion of a passive circuit component is at least partially disposed. The second semiconductor die includes a second layer of dielectric material at which a second portion of conductive material implementing a second portion of the passive circuit component is at least partially disposed. A first contact pad at the first layer of dielectric material and a second contact pad at a second layer of dielectric material are coupled to create an interconnect electrically coupling the first semiconductor die and the second semiconductor die. A metal-metal bond is formed between the first portion of the passive circuit component and the second portion of the passive circuit component to create the passive circuit component.
