17884475. SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
Organization Name
Inventor(s)
Kunal R. Parekh of Boise ID (US)
Bret K. Street of Meridian ID (US)
Kyle K. Kirby of Eagle ID (US)
Thiagarajan Raman of Boise ID (US)
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17884475 titled 'SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
Simplified Explanation
The patent application discloses techniques for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies.
- Semiconductor assembly includes a semiconductor die coupled to a substrate with the active surface of the die orthogonal to the top surface of the substrate.
- The substrate has a recessed slot where a side surface of the semiconductor die couples.
- The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot, enabling robust and cost-efficient assembly.
Potential Applications
- Semiconductor manufacturing industry
- Electronics industry
- Consumer electronics
Problems Solved
- Efficient assembly of semiconductor devices
- Cost-effective manufacturing process
- Improved reliability of semiconductor assemblies
Benefits
- Robust semiconductor device assembly
- Cost-efficient manufacturing process
- Improved reliability and performance of semiconductor devices
Original Abstract Submitted
This document discloses techniques, apparatuses, and systems for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies. A semiconductor assembly is described that includes a semiconductor die coupled to a substrate such that an active surface of the semiconductor die is substantially orthogonal to a top surface of the substrate. The substrate includes a surface having a recessed slot at which a side surface of the semiconductor die couples. The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot. In doing so, the techniques, apparatuses, and systems herein enable a robust and cost-efficient semiconductor device to be assembled.
