18478031. MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
Contents
MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS
Organization Name
Inventor(s)
Fatma Arzum Simsek-ege of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
Terrence B. Mcdaniel of Boise ID (US)
Beau D. Barry of Boise ID (US)
MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18478031 titled 'MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS
Simplified Explanation
The patent application describes a method of forming a microelectronic device by combining multiple device structures.
- A first microelectronic device structure is formed, which includes a semiconductor structure, an isolation material, and conductive routing structures.
- A second microelectronic device structure is formed, which includes another semiconductor structure and isolation material.
- The second isolation material is bonded to the first isolation material, attaching the second device structure to the first.
- Memory cells are formed using portions of the second semiconductor structure after attaching the second device structure.
- Control logic devices, including transistors, are formed using portions of the first semiconductor structure after forming the memory cells.
Potential applications of this technology:
- This method can be used in the manufacturing of microelectronic devices, such as integrated circuits, to combine different device structures into a single device.
Problems solved by this technology:
- The method allows for the integration of different device structures, such as memory cells and control logic devices, into a single microelectronic device.
Benefits of this technology:
- By combining multiple device structures, the overall size and complexity of the microelectronic device can be reduced.
- The method provides a more efficient and cost-effective way of manufacturing microelectronic devices with different functionalities.
Original Abstract Submitted
A method of forming a microelectronic device comprises forming a first microelectronic device structure comprising a first semiconductor structure, a first isolation material over the first semiconductor structure, and first conductive routing structures over the first semiconductor structure and surrounded by the first isolation material. A second microelectronic device structure comprising a second semiconductor structure and a second isolation material over the second semiconductor structure is formed. The second isolation material is bonded to the first isolation material to attach the second microelectronic device structure to the first microelectronic device structure. Memory cells comprising portions of the second semiconductor structure are formed after attaching the second microelectronic device structure to the first microelectronic device structure. Control logic devices including transistors comprising portions of the first semiconductor structure are formed after forming the memory cells. Microelectronic devices, electronic systems, and additional methods are also described.
