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Category:H01L23/34
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Pages in category "H01L23/34"
The following 15 pages are in this category, out of 15 total.
1
- 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17859411. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 17940623. FERROELECTRIC MEMORY DEVICE ERASURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18133178. SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18187444. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18265578. BONDED CONNECTION MEANS simplified abstract (Siemens Aktiengesellschaft)
- 18341381. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation)