17879089. SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF
Organization Name
Inventor(s)
Jungpil Lee of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17879089 titled 'SEMICONDUCTOR PACKAGE AND THERMAL MANAGEMENT METHOD THEREOF
Simplified Explanation
The patent application describes semiconductor packages and methods for managing their thermal performance. These packages consist of an upper semiconductor chip and a lower semiconductor chip connected through a series of through electrodes. The lower chip includes a temperature sensor, a power control unit, a power switching element, and a clock control element.
- The lower semiconductor chip includes a temperature sensor to monitor the temperature of the upper semiconductor chip.
- A power control unit is connected to the temperature sensor to regulate power based on the temperature readings.
- A power switching element is connected to at least one of the through electrodes, allowing for efficient power distribution.
- A clock control element is connected to another through electrode, enabling precise timing control.
Potential Applications
- This technology can be applied in various electronic devices that require efficient thermal management, such as smartphones, laptops, and servers.
- It can also be used in high-performance computing systems, where temperature control is crucial for optimal performance.
Problems Solved
- Semiconductor chips generate heat during operation, which can lead to performance degradation or even failure if not managed properly. This technology addresses the challenge of thermal management in semiconductor packages.
- By incorporating temperature sensors and power control units, the system can dynamically adjust power distribution based on the temperature readings, preventing overheating and ensuring reliable operation.
Benefits
- Improved thermal management: The temperature sensors and power control units enable real-time monitoring and adjustment of power distribution, preventing overheating and improving overall performance.
- Enhanced reliability: By actively managing the temperature, this technology helps to prolong the lifespan of semiconductor chips and reduce the risk of failure.
- Efficient power distribution: The power switching element allows for efficient power delivery to different parts of the semiconductor package, optimizing energy usage and reducing waste.
References
[Link to the patent application]
Original Abstract Submitted
Disclosed are semiconductor packages and thermal management methods thereof. The semiconductor package includes an upper semiconductor chip; and a lower semiconductor chip connected via a plurality of through electrodes to the upper semiconductor chip. The lower semiconductor chip may include at least one temperature sensor configured to sense a temperature of the upper semiconductor chip, a power control unit connected to the at least one temperature sensor, a power switching element connected to at least a first one of the plurality of through electrodes, and a clock control element connected to at least a second one of the plurality of through electrodes.
