18341381. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyun Soo Chung of Suwon-si (KR)
Won-Young Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18341381 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a buffer structure with multiple layers and a molding layer. It also includes a chip stack with a buffer chip and a semiconductor chip, where the buffer chip overlaps with a portion of the semiconductor chip.
- The semiconductor package includes a buffer structure with redistribution layers and a molding layer.
- A chip stack is formed on the buffer structure, consisting of a buffer chip and a semiconductor chip.
- The buffer chip overlaps with a portion of the semiconductor chip in a specific direction.
Potential Applications:
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved:
- The buffer structure and chip stack provide a compact and efficient design for integrating multiple chips in a semiconductor package.
- The overlapping of the buffer chip with the semiconductor chip allows for better connectivity and signal transmission.
Benefits:
- The semiconductor package offers improved performance and functionality by integrating multiple chips in a compact design.
- The buffer structure and chip stack provide enhanced electrical connectivity and signal transmission.
- The package design allows for efficient use of space and can contribute to cost savings in manufacturing.
Original Abstract Submitted
A semiconductor package including a buffer structure including a first redistribution layer, a first buffer chip on the first redistribution layer, a second redistribution layer on the first buffer chip, and a first molding layer filling between the first redistribution layer and the second redistribution layer, and a first chip stack and a first semiconductor chip on the buffer structure and spaced apart from each other, wherein the first buffer chip overlaps at least a portion of the first semiconductor chip in a first direction from the buffer structure toward the first semiconductor chip, may be provided.
