Category:Bai Nie of Chandler AZ US
Bai Nie
Bai Nie from Chandler AZ US has applied for patents in technology areas such as H01L23/15, H01L21/48, H01L23/00 with intel corporation.
Patents
Pages in category "Bai Nie of Chandler AZ US"
The following 15 pages are in this category, out of 15 total.
1
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18469674. LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES (Intel Corporation)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)
- 18478250. ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS (INTEL CORPORATION)
I
- Intel corporation (20250022786). METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Intel corporation (20250096052). LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112165). ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
- Intel corporation (20250112175). MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Intel corporation (20250113434). THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION