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• 18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
  =PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD= ==PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD - A simplified explanation of the abstract== ...
  5 KB (700 words) - 04:36, 2 February 2024
• 18243725. WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
  ...STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE= ...STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE - A simplified explanation of the abstract== ...
  2 KB (296 words) - 23:43, 16 March 2024
• Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
  =Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding= ==Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding - A simplified explanation of the abstract== ...
  3 KB (432 words) - 06:45, 10 April 2024
• 18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
  ...ER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR= ...ER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR - A simplified explanation of the abstract== ...
  4 KB (569 words) - 09:21, 25 January 2024
• Samsung electronics co., ltd. (20240298787). WAFER CLEANING BRUSH, WAFER CLEANING DEVICE INCLUDING THE SAME, AND WAFER CLEANING METHOD USING THE SAME simplified abstract
  =WAFER CLEANING BRUSH, WAFER CLEANING DEVICE INCLUDING THE SAME, AND WAFER CLEANING METHOD USING THE SAME= ==WAFER CLEANING BRUSH, WAFER CLEANING DEVICE INCLUDING THE SAME, AND WAFER CLEANING METHOD USING THE SAME - A simplified explanation of the abstract== ...
  3 KB (425 words) - 06:31, 12 September 2024
• 18236691. WAFER CLEANING BRUSH, WAFER CLEANING DEVICE INCLUDING THE SAME, AND WAFER CLEANING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
  =WAFER CLEANING BRUSH, WAFER CLEANING DEVICE INCLUDING THE SAME, AND WAFER CLEANING METHOD USING THE SAME= ==WAFER CLEANING BRUSH, WAFER CLEANING DEVICE INCLUDING THE SAME, AND WAFER CLEANING METHOD USING THE SAME - A simplified explanation of the abstract== ...
  3 KB (444 words) - 04:06, 19 September 2024
• Samsung electronics co., ltd. (20240279003). WAFER TRANSFER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS simplified abstract
  ...FER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS= ...FER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS - A simplified explanation of the abstract== ...
  4 KB (626 words) - 05:51, 22 August 2024
• 18371707. WAFER TRANSFER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
  ...FER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS= ...FER APPARATUS, WAFER TRANSFER SYSTEM, AND METHOD FOR REMOVING PARTICLES IN WAFER TRANSFER APPARATUS - A simplified explanation of the abstract== ...
  4 KB (625 words) - 09:42, 22 August 2024
• Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
  ...e with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding= ...e with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding - A simplified explanation of the abstract== ...
  4 KB (561 words) - 06:45, 10 April 2024
• Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
  ...e with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding= ...e with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding - A simplified explanation of the abstract== ...
  4 KB (557 words) - 06:45, 10 April 2024
• 20240087940.WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE simplified abstract (samsung electronics co., ltd.)
  ...STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE= ...STACK STRUCTURE, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER BY USING THE WAFER TEMPORARY ADHESIVE TAPE - A simplified explanation of the abstract== ...
  3 KB (492 words) - 02:14, 20 March 2024
• Patent Application 17779199 - WAFER PROCESSING TEMPORARY ADHESIVE WAFER - Rejection
  = Patent Application 17779199 - WAFER PROCESSING TEMPORARY ADHESIVE WAFER = '''Title:''' WAFER PROCESSING TEMPORARY ADHESIVE, WAFER LAMINATE, THIN WAFER MANUFACTURING METHOD ...
  13 KB (1,997 words) - 01:52, 23 May 2025
• Patent Application 18009773 - WAFER LOCKING MECHANISM WAFER POSITIONING DEVICE - Rejection
  = Patent Application 18009773 - WAFER LOCKING MECHANISM WAFER POSITIONING DEVICE = '''Title:''' WAFER LOCKING MECHANISM, WAFER POSITIONING DEVICE AND WAFER CONVEYING APPARATUS ...
  12 KB (1,756 words) - 03:32, 28 April 2025
• Patent Application 17590263 - WAFER DRYING APPARATUS WAFER PROCESSING SYSTEM - Rejection
  = Patent Application 17590263 - WAFER DRYING APPARATUS WAFER PROCESSING SYSTEM = ...'' WAFER DRYING APPARATUS, WAFER PROCESSING SYSTEM INCLUDING THE SAME, AND WAFER PROCESSING METHOD USING THE SAME ...
  14 KB (2,072 words) - 02:38, 29 April 2025
• Micron technology, inc. (20250149362). WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS
  ...re data produced by at least the one or more sensors or the processor. the wafer storage device may also include a power storage device configured to receiv =WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS= ...
  4 KB (543 words) - 05:53, 9 May 2025
• 19019194. WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS (Micron Technology, Inc.)
  ...re data produced by at least the one or more sensors or the processor. The wafer storage device may also include a power storage device configured to receiv =WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS= ...
  4 KB (543 words) - 02:19, 11 May 2025
• Patent Application 17816055 - NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING - Rejection
  = Patent Application 17816055 - NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING = '''Title:''' NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE ...
  43 KB (6,375 words) - 03:20, 23 May 2025
• 18730257. APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT (Lam Research Corporation)
  =APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT= ==APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT== ...
  2 KB (329 words) - 05:19, 11 April 2025
• 17848844. THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING simplified abstract (Samsung Electronics Co., Ltd.)
  =THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING= ==THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING - A simplified explanation of the abstract== ...
  4 KB (556 words) - 04:26, 2 January 2024
• Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract
  =WAFER PROCESSING APPARATUS AND WAFER DICING METHOD= ==WAFER PROCESSING APPARATUS AND WAFER DICING METHOD - A simplified explanation of the abstract== ...
  3 KB (435 words) - 02:47, 23 May 2024

Page text matches

• Stmicroelectronics international n.v. (20250002333). WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
  =WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME= ==WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME== ...
  2 KB (229 words) - 10:11, 17 February 2025
• 18753610. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
  =PROCESSING METHOD OF WAFER= ==PROCESSING METHOD OF WAFER== ...
  1 KB (224 words) - 08:52, 18 February 2025
• Tokyo electron limited (20250132180). WAFER BOW METROLOGY SYSTEM
  =WAFER BOW METROLOGY SYSTEM= ==WAFER BOW METROLOGY SYSTEM== ...
  1 KB (215 words) - 11:20, 28 April 2025
• 18621827. WAFER BOW METROLOGY SYSTEM (Tokyo Electron Limited)
  =WAFER BOW METROLOGY SYSTEM= ==WAFER BOW METROLOGY SYSTEM== ...
  1 KB (215 words) - 12:54, 28 April 2025
• DAISY-CHAIN SEAL RING STRUCTURE: abstract simplified (18335413)
  ...structure in the first wafer with the third metal structure in the second wafer. ...tal structure through the interface between the first wafer and the second wafer. ...
  1 KB (234 words) - 17:00, 16 October 2023
• DISCO CORPORATION patent applications published on January 9th, 2025
  ...ARATING APPARATUS ([[DISCO CORPORATION (18755918). METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS|18755918]])=== ===WAFER PROCESSING METHOD ([[DISCO CORPORATION (18742173). WAFER PROCESSING METHOD|18742173]])=== ...
  1 KB (112 words) - 08:52, 18 February 2025
• Micron technology, inc. (20250133786). ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
  =ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY= ==ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY== ...
  1 KB (168 words) - 10:41, 28 April 2025
• 18914918. ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY (MICRON TECHNOLOGY, INC.)
  =ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY= ==ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY== ...
  1 KB (168 words) - 12:45, 28 April 2025
• Taiwan semiconductor manufacturing co., ltd. (20250118587). SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLICATIONS
  =SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLICATIONS= ==SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLICATIONS== ...
  2 KB (269 words) - 03:38, 11 April 2025
• 18979734. SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLICATIONS (Taiwan Semiconductor Manufacturing Co., Ltd.)
  =SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLICATIONS= ==SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLICATIONS== ...
  2 KB (269 words) - 04:33, 11 April 2025
• US Patent Application 18362037. SEMICONDUCTOR WAFER COOLING simplified abstract
  =SEMICONDUCTOR WAFER COOLING= ==SEMICONDUCTOR WAFER COOLING - A simplified explanation of the abstract== ...
  2 KB (278 words) - 15:11, 30 November 2023
• US Patent Application 18337470. SEMICONDUCTOR WAFER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING simplified abstract
  ...ER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING= ...ER TESTING SYSTEM AND RELATED METHOD FOR IMPROVING EXTERNAL MAGNETIC FIELD WAFER TESTING - A simplified explanation of the abstract== ...
  2 KB (337 words) - 05:52, 26 October 2023
• 18910669. METHOD AND APPARATUS FOR DIVIDING WAFER (DISCO CORPORATION)
  =METHOD AND APPARATUS FOR DIVIDING WAFER= ==METHOD AND APPARATUS FOR DIVIDING WAFER== ...
  1 KB (224 words) - 05:30, 11 April 2025
• 18742173. WAFER PROCESSING METHOD (DISCO CORPORATION)
  =WAFER PROCESSING METHOD= ==WAFER PROCESSING METHOD== ...
  1 KB (200 words) - 08:52, 18 February 2025
• US Patent Application 18356388. WAFER THINNING METHOD HAVING FEEDBACK CONTROL simplified abstract
  =WAFER THINNING METHOD HAVING FEEDBACK CONTROL= ==WAFER THINNING METHOD HAVING FEEDBACK CONTROL - A simplified explanation of the a ...
  2 KB (276 words) - 11:10, 9 November 2023
• 20250233106. Integrated Semiconductor Packaging System Enhanced Dielectric-to-dielectric Bonding Qual (Taiwan Semiconductor Manufacturing , .)
  ...d bonding, by the wafer-to-wafer bonding tool, the top wafer to the bottom wafer. ...
  2 KB (298 words) - 03:15, 21 July 2025
• Samsung electronics co., ltd. (20250060685). WAFER ALIGNMENT SYSTEM AND WAFER ALIGNMENT METHOD
  =WAFER ALIGNMENT SYSTEM AND WAFER ALIGNMENT METHOD= ==WAFER ALIGNMENT SYSTEM AND WAFER ALIGNMENT METHOD== ...
  2 KB (231 words) - 03:54, 19 March 2025
• 18755918. METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS (DISCO CORPORATION)
  =METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS= ==METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS== ...
  1,023 bytes (143 words) - 08:51, 18 February 2025
• US Patent Application 18335413. DAISY-CHAIN SEAL RING STRUCTURE simplified abstract
  ...structure of the first wafer with the third metal structure of the second wafer. ...tal structure through the interface between the first wafer and the second wafer. ...
  2 KB (305 words) - 10:40, 18 October 2023
• US Patent Application 18356084. WAFER PROCESSING METHOD simplified abstract
  =WAFER PROCESSING METHOD= ==WAFER PROCESSING METHOD - A simplified explanation of the abstract== ...
  2 KB (278 words) - 06:50, 10 November 2023