18621827. WAFER BOW METROLOGY SYSTEM (Tokyo Electron Limited)
WAFER BOW METROLOGY SYSTEM
Organization Name
Inventor(s)
WAFER BOW METROLOGY SYSTEM
This abstract first appeared for US patent application 18621827 titled 'WAFER BOW METROLOGY SYSTEM
Original Abstract Submitted
Aspects of the present disclosure provide a metrology system for measuring wafer bow of a wafer. For example, the metrology system can include a wafer support configured to position a wafer for wafer bow measurement, a first light source configured to illuminate a first side of the wafer during the wafer bow measurement, and a first pinhole mask disposed between the first light source and the wafer support. The first pinhole mask can include a plurality of first pinholes that are arranged to pass first light from the first light source and project onto the first side of the wafer a plurality of first dots that correspond to the first pinholes in the first pinhole mask. The metrology system can also include a first camera arranged to capture an image of the first dots from the first side of the wafer during the wafer bow measurement.