18742173. WAFER PROCESSING METHOD (DISCO CORPORATION)

WAFER PROCESSING METHOD

Organization Name

DISCO CORPORATION

Inventor(s)

Akira Mizutani of Tokyo (JP)

Yusuke Ohtake of Tokyo (JP)

WAFER PROCESSING METHOD

This abstract first appeared for US patent application 18742173 titled 'WAFER PROCESSING METHOD

Original Abstract Submitted

A wafer processing method includes a modified layer forming step of forming a modified layer along a chamfered portion by applying a laser beam having a wavelength transmissible through a wafer with a condensing point of the laser beam positioned in an inner part of a boundary portion between an effective region and the chamfered portion, a chamfered portion removing step of scattering and removing the chamfered portion by a centrifugal force by holding the wafer on a spinner table and rotating the wafer at high speed after the modified layer forming step is performed, and a processing step of processing the wafer to thin the wafer to a desired thickness by grinding an undersurface of the wafer after the chamfered portion removing step is performed.