Category:H01L25/18
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H01L 25/18 - Overview
H01L 25/18 is a subsection of the International Patent Classification system, specifically within the category of H01L, which pertains to semiconductor devices; electric solid state devices not otherwise provided for. This particular code focuses on:
- Semiconductor Devices
- Aspects related to semiconductor devices which are structurally and functionally integrated.
- Electric Solid State Devices
- This involves devices that leverage the electrical properties of solid materials to control the flow of current.
- Multi-chip Modules (MCM)
- H01L 25/18 specifically addresses multi-chip modules (MCM). These are electronic components where multiple integrated circuits (ICs), semiconductor dies, or other discrete components are packaged onto a unifying substrate, enhancing performance and reducing size.
Key Innovations and Companies in H01L 25/18
Several companies have made significant contributions in the field covered by H01L 25/18:
- Intel Corporation
- Intel has been a leader in developing advanced multi-chip modules, integrating various functions like CPU, GPU, and memory in compact forms. Their innovations often involve high-speed interconnects and efficient heat dissipation technologies.
- Samsung Electronics
- Samsung's advancements in multi-chip module technology are notable, particularly in the integration of memory and logic components, which is crucial for mobile devices and high-performance computing systems.
- Lesser-Known Innovators
- Smaller companies like XYZ Semiconductors (fictional example) also contribute significantly to this field, often focusing on specialized applications or novel integration techniques.
IPC Classifications and Categories
The innovations in H01L 25/18 fall into several categories under the IPC system. These include:
- H01L29 - Semiconductor devices based on specific semiconductors
- H01L31 - Solid state devices using organic materials
See Also
Pages in category "H01L25/18"
The following 79 pages are in this category, out of 279 total.
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- Samsung electronics co., ltd. (20240105703). FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME simplified abstract
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- Samsung electronics co., ltd. (20240120280). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128195). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128230). SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136201). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240136273). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136329). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240136334). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240138157). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162133). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240162181). SEMICONDUCTOR PACKAGES simplified abstract
- Samsung electronics co., ltd. (20240162213). CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240178176). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240179910). SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240179925). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240188309). MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240194614). SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240196622). SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240196633). MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract
- SK hynix Inc. patent applications on January 18th, 2024
- SK hynix Inc. patent applications on May 30th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240096812). Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162166). THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186308). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105530). Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105701). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120315). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136346). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Texas instruments incorporated (20240113094). GALVANIC ISOLATION DEVICE simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
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- US Patent Application 17828803. POWER CONVERTER MODULE simplified abstract
- US Patent Application 17898834. INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
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- US Patent Application 18057305. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- US Patent Application 18098972. SEMICONDUCTOR PACKAGE simplified abstract
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- US Patent Application 18233697. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A METAL OXIDE ETCH STOP LAYER AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18353901. PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18363769. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18366788. SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18446291. Semiconductor Devices and Methods of Manufacturing simplified abstract
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- US Patent Application 18448284. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18450241. Non-Volatile Memory Device and Method of Operating the Same simplified abstract