US Patent Application 18353901. PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract

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PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Yu-Sheng Lin of Hsinchu County (TW)

Po-Yao Lin of Hsinchu County (TW)

Shu-Shen Yeh of Taoyuan City (TW)

Chin-Hua Wang of New Taipei City (TW)

Shin-Puu Jeng of Hsinchu (TW)

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18353901 titled 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The patent application describes a package structure for electronic devices.

  • The package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure, and a heat dissipation structure.
  • The semiconductor package is placed on and connected to the circuit substrate.
  • A thermal interface material is applied on top of the semiconductor package to enhance heat transfer.
  • The lid structure surrounds the semiconductor package and is placed on the circuit substrate.
  • The lid structure includes a supporting part that partially covers and makes physical contact with the thermal interface material.
  • A heat dissipation structure is placed on top of the lid structure and makes physical contact with the supporting part.
  • The heat dissipation structure helps to dissipate heat from the semiconductor package and improve overall thermal management.


Original Abstract Submitted

A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.

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