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Category:H10N60/82
Subcategories
This category has the following 6 subcategories, out of 6 total.
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Pages in category "H10N60/82"
The following 23 pages are in this category, out of 23 total.
1
- 17384159. DUAL-SUPERCONDUCTOR QUANTUM TRANSDUCER simplified abstract (International Business Machines Corporation)
- 18069996. SOLDER-SHIELDED CHIP BONDING simplified abstract (International Business Machines Corporation)
- 18334919. Nanowire Avalanche Photodetector (The Boeing Company)
- 18351575. SUPERCONDUCTING DEVICE, METHOD OF MANUFACTURING SUPERCONDUCTING DEVICE, AND LAMINATED BODY simplified abstract (Fujitsu Limited)
- 18414001. SUPERCONDUCTING QUBIT AND DEVICE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 19014720. AIR BRIDGE STRUCTURE AND FABRICATION METHOD (Tencent Technology (Shenzhen) Company Limited)
I
- International business machines corporation (20240215460). SOLDER-SHIELDED CHIP BONDING simplified abstract
- International business machines corporation (20240337896). DUAL-SUPERCONDUCTOR QUANTUM TRANSDUCER simplified abstract
- International Business Machines Corporation patent applications on January 23rd, 2025
- International Business Machines Corporation patent applications on June 27th, 2024
- International Business Machines Corporation patent applications on October 10th, 2024
Q
S
- Samsung electronics co., ltd. (20240423101). SUPERCONDUCTING QUBIT AND DEVICE INCLUDING THE SAME
- SAMSUNG ELECTRONICS CO., LTD. (20240423101). SUPERCONDUCTING QUBIT AND DEVICE INCLUDING THE SAME
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 13th, 2025