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19014720. AIR BRIDGE STRUCTURE AND FABRICATION METHOD (Tencent Technology (Shenzhen) Company Limited)

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AIR BRIDGE STRUCTURE AND FABRICATION METHOD

Organization Name

Tencent Technology (Shenzhen) Company Limited

Inventor(s)

Wenlong Zhang of Shenzhen CN

Sainan Huai of Shenzhen CN

Yarui Zheng of Shenzhen CN

Jiagui Feng of Suzhou CN

Kanglin Xiong of Suzhou CN

Sunan Ding of Suzhou CN

AIR BRIDGE STRUCTURE AND FABRICATION METHOD

This abstract first appeared for US patent application 19014720 titled 'AIR BRIDGE STRUCTURE AND FABRICATION METHOD

Original Abstract Submitted

In a method for fabricating an air bridge, an air bridge brace structure is formed on a substrate. A continuous air bridge material layer is formed over the air bridge brace structure and the substrate. One or more openings are formed in the continuous air bridge material layer to reveal portions of the air bridge brace structure. A bridge brace material of the air bridge brace structure is removed through the one or more openings to obtain the air bridge. The air bridge includes the substrate and an air bridge structure that is disposed on the substrate. The air bridge structure includes the one or more openings. The one or more openings includes a first opening configured to pass through an etchant used to remove the bridge brace material. The one or more openings includes a second opening configured to pass through the bridge brace material removed by the etchant.

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