SOLDER-SHIELDED CHIP BONDING

Organization Name

international business machines corporation

Inventor(s)

SOLDER-SHIELDED CHIP BONDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240215460 titled 'SOLDER-SHIELDED CHIP BONDING

Simplified Explanation: The patent application describes a structure involving two devices, each with superconducting lines, connected through a solder-bonded layer.

Key Features and Innovation:

Structure includes a first device with a first chip and a second chip, and a second device with superconducting lines.
Solder-bonded layer attaches the first chip to the second chip.
Second device has pads facing bumps on the second chip, connected through a solder shield material.
Solder shield material connects the superconducting lines of both devices.

Potential Applications: This technology could be used in high-speed computing, quantum computing, and other applications requiring superconducting connections.

Problems Solved: This technology solves the challenge of creating reliable connections between superconducting lines in complex electronic devices.

Benefits:

Improved reliability and performance in superconducting electronic devices.
Enhanced signal transmission and reduced signal loss.
Potential for advancements in quantum computing and other high-tech fields.

Commercial Applications: The technology could be applied in the development of advanced superconducting computers, communication systems, and scientific research equipment.

Prior Art: Researchers may want to explore prior patents related to superconducting interconnect technologies and solder bonding in electronic devices.

Frequently Updated Research: Stay informed on the latest developments in superconducting technology, solder bonding techniques, and applications in quantum computing.

Questions about Superconducting Interconnect Technology: 1. How does this technology improve signal transmission in electronic devices? 2. What are the potential challenges in scaling up this technology for commercial applications?

Original Abstract Submitted

a structure includes a first device having a first chip and a second chip. the second chip has a first side with a plurality of bumps and a second side with a plurality of first superconducting lines. a solder bonded layer attaches the first chip to the second chip. a second device has a first side with a plurality of pads facing the plurality of bumps in the second chip and a second side opposite the first side having a plurality of second superconducting lines. a solder shield material surrounds the plurality of bumps and the plurality of pads, and the plurality of bumps on the second chip are bonded to the plurality of pads on the second device. the solder shield material is connected to the plurality of first superconducting lines of the first device and to the plurality of second superconducting lines of the second device.