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Category:H01P3/08
Subcategories
This category has the following 13 subcategories, out of 13 total.
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C
D
J
K
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U
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Pages in category "H01P3/08"
The following 77 pages are in this category, out of 77 total.
1
- 17630676. MICRO-WAVE TRANSDUCER AND MANUFACTURING METHOD THEREOF simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17907800. AU and RU having CWG Filters, and BS having the AU or RU simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 17922969. ANTENNA MODULE HAVING MULTILAYER IMPEDANCE CONVERTER, AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract (LG ELECTRONICS INC.)
- 17923344. SPLITTER-COMBINER AND CASCADE CONNECTION CIRCUIT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17933693. MICROSTRIP CROSSTALK REDUCTION simplified abstract (International Business Machines Corporation)
- 17948893. STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract (Dell Products L.P.)
- 17988566. Power Divider and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18020962. WAVEGUIDE CONVERSION DEVICE AND ELECTRONIC APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18183200. CRYOGENIC INTEGRATED CIRCUIT WITH A RESONATOR FORMED BY SUPERCONDUCTING METAL simplified abstract (International Business Machines Corporation)
- 18210479. COMMON MODE FILTER AND SIGNAL TRANSMISSION CIRCUIT simplified abstract (INVENTEC (PUDONG) TECHNOLOGY CORPORATION)
- 18210479. COMMON MODE FILTER AND SIGNAL TRANSMISSION CIRCUIT simplified abstract (INVENTEC CORPORATION)
- 18215480. MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC (Intel Corporation)
- 18262825. ANTENNA DEVICE, RADAR DEVICE AND VEHICLE CONTROL SYSTEM simplified abstract (Sony Semiconductor Solutions Corporation)
- 18278928. HIGH FREQUENCY CIRCUIT simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18298357. HIGH-FREQUENCY TRANSMISSION ELEMENT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18334201. WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES (Intel Corporation)
- 18339509. LOW EMISSION THREE-DIMENSIONAL FREQUENCY MULTIPLEXER (QUALCOMM Incorporated)
- 18356613. HIGH-FREQUENCY CIRCUIT simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18418694. COUPLED CONDUCTORS IN TWINAX CABLE AND STRIPLINE PRINTED CIRCUIT BOARD FOR SKEW MITIGATION (Cisco Technology, Inc.)
- 18423565. TRANSITION CIRCUIT AND COMMUNICATION DEVICE (KABUSHIKI KAISHA TOSHIBA)
- 18554170. WIRING BOARD simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18639920. FEED NETWORK, ANTENNA APPARATUS, AND COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18663089. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18672016. TRANSMISSION LINE CONNECTION STRUCTURE simplified abstract (Huawei Technologies Co., Ltd.)
- 18774455. Wideband Millimeter Wave Via Transition (Apple Inc.)
- 18963838. NEAR FIELD WIRELESS COMMUNICATION SYSTEM FOR MOTHER TO PACKAGE AND PACKAGE TO PACKAGE SIDEBAND DIGITAL COMMUNICATION (Intel Corporation)
2
- 20240047844. HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS simplified abstract (CommScope Technologies LLC)
- 20240079781.Ultra-wideband Antenna Matching simplified abstract (apple inc.)
- 20240079786.Electronic Device Having Antenna Tuning Components Across a Knuckle simplified abstract (apple inc.)
5
A
- Apple inc. (20240357733). Eddy Current Mitigation for On-Chip Inductors simplified abstract
- Apple inc. (20240357734). Eddy Current Mitigation for On-Chip Inductors simplified abstract
- Apple inc. (20250016923). Wideband Millimeter Wave Via Transition
- Apple Inc. (20250016923). Wideband Millimeter Wave Via Transition
- Apple Inc. patent applications on January 9th, 2025
- Apple Inc. patent applications on October 24th, 2024
B
C
D
H
- Huawei technologies co., ltd. (20240266751). FEED NETWORK, ANTENNA APPARATUS, AND COMMUNICATION DEVICE simplified abstract
- Huawei technologies co., ltd. (20240313382). TRANSMISSION LINE CONNECTION STRUCTURE simplified abstract
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on August 8th, 2024
- Huawei Technologies Co., Ltd. patent applications on September 19th, 2024
I
- Intel corporation (20240421465). WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Intel corporation (20250006666). MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC
- Intel corporation (20250093413). NEAR FIELD WIRELESS COMMUNICATION SYSTEM FOR MOTHER TO PACKAGE AND PACKAGE TO PACKAGE SIDEBAND DIGITAL COMMUNICATION
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on March 20th, 2025
- International business machines corporation (20240098882). MICROSTRIP CROSSTALK REDUCTION simplified abstract
- International business machines corporation (20240315149). CRYOGENIC INTEGRATED CIRCUIT WITH A RESONATOR FORMED BY SUPERCONDUCTING METAL simplified abstract
- International Business Machines Corporation patent applications on March 21st, 2024
- International Business Machines Corporation patent applications on September 19th, 2024
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L
N
Q
- Qualcomm incorporated (20240291130). Directional Coupler and Associated Ground Structure simplified abstract
- Qualcomm incorporated (20240429587). LOW EMISSION THREE-DIMENSIONAL FREQUENCY MULTIPLEXER
- QUALCOMM Incorporated patent applications on August 29th, 2024
- QUALCOMM Incorporated patent applications on December 26th, 2024
T
- Taiwan semiconductor manufacturing company, ltd. (20240304561). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379592). Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024