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Category:H01L23/467
Subcategories
This category has the following 4 subcategories, out of 4 total.
C
D
R
Pages in category "H01L23/467"
The following 36 pages are in this category, out of 36 total.
1
- 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18069507. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18071399. ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT simplified abstract (Intel Corporation)
- 18149990. HEAT SINK WITH TURBULENT STRUCTURES simplified abstract (Google LLC)
- 18218322. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18494023. PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIENTED INTEGRATED CIRCUIT DIES (Intel Corporation)
- 18499660. THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION (NXP USA, Inc.)
- 18674894. APPARATUS INCLUDING COOLING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
B
D
I
- Intel corporation (20240103073). COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS simplified abstract
- Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract
- Intel corporation (20240175917). ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT simplified abstract
- Intel corporation (20240213116). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES simplified abstract
- Intel corporation (20240413054). INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD DISTRIBUTION
- Intel corporation (20250140741). PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIENTED INTEGRATED CIRCUIT DIES
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 1st, 2025
- Intel Corporation patent applications on May 30th, 2024