APPARATUS INCLUDING COOLING STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor(s)

Tung-Liang Shao of Hsinchu (TW)

Lawrence Chiang Sheu of Hsinchu City (TW)

Chih-Hang Tung of Hsinchu (TW)

Chen-Hua Yu of Hsinchu City (TW)

Yi-Li Hsiao of Hsinchu City (TW)

APPARATUS INCLUDING COOLING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18674894 titled 'APPARATUS INCLUDING COOLING STRUCTURE

Simplified Explanation: The patent application describes an apparatus with a cooling structure that is positioned over the back side of a semiconductor component. The cooling structure includes a housing, a liquid delivery device, and a gas exhaust device.

The housing contains a cooling space next to the semiconductor component.
The liquid delivery device connects to an inlet of the housing and delivers a liquid coolant into the cooling space.
The gas exhaust device connects to an outlet of the housing and reduces the pressure within the housing.

Key Features and Innovation:

Cooling structure positioned over the back side of the semiconductor component.
Housing with a cooling space adjacent to the semiconductor component.
Liquid delivery device for supplying liquid coolant into the cooling space.
Gas exhaust device for lowering the pressure within the housing.

Potential Applications: This technology could be used in various electronic devices, such as computers, servers, and mobile devices, to improve cooling efficiency and performance.

Problems Solved: This technology addresses the issue of overheating in semiconductor components, which can lead to reduced performance and potential damage.

Benefits:

Enhanced cooling efficiency for semiconductor components.
Improved performance and reliability of electronic devices.
Prevention of overheating-related issues.

Commercial Applications: Potential commercial applications include the manufacturing of high-performance computers, servers, and other electronic devices that require efficient cooling systems to maintain optimal performance.

Questions about Cooling Structure Technology: 1. How does the liquid delivery device contribute to the cooling process? 2. What are the potential market implications of implementing this cooling structure technology in electronic devices?

Frequently Updated Research: Stay updated on advancements in semiconductor cooling technology and research related to improving cooling efficiency in electronic devices.

Original Abstract Submitted

An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.