APPARATUS INCLUDING COOLING STRUCTURE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Tung-Liang Shao of Hsinchu (TW)

Lawrence Chiang Sheu of Hsinchu City (TW)

Chih-Hang Tung of Hsinchu (TW)

Chen-Hua Yu of Hsinchu City (TW)

Yi-Li Hsiao of Hsinchu City (TW)

APPARATUS INCLUDING COOLING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240312872 titled 'APPARATUS INCLUDING COOLING STRUCTURE

The abstract describes an apparatus comprising a semiconductor component and a cooling structure positioned over the back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device, and a gas exhaust device. The housing has a cooling space adjacent to the semiconductor component, the liquid delivery device is connected to an inlet of the housing to deliver a liquid coolant into the cooling space, and the gas exhaust device is connected to an outlet of the housing to lower the pressure within the housing.

The apparatus includes a semiconductor component and a cooling structure.
The cooling structure is positioned over the back side of the semiconductor component.
The housing of the cooling structure has a cooling space adjacent to the semiconductor component.
A liquid delivery device is connected to an inlet of the housing to deliver a liquid coolant into the cooling space.
A gas exhaust device is connected to an outlet of the housing to lower the pressure within the housing.

Potential Applications: - This technology can be used in high-performance computing systems. - It can be applied in data centers to cool down server components efficiently. - The apparatus can find use in automotive electronics to prevent overheating of semiconductor components.

Problems Solved: - Addresses the issue of overheating in semiconductor components. - Provides an efficient cooling solution for high-power electronic devices.

Benefits: - Improved performance and reliability of semiconductor components. - Enhanced cooling efficiency leading to extended lifespan of electronic devices.

Commercial Applications: Title: Advanced Cooling System for Semiconductor Components This technology can be commercialized for use in data centers, automotive electronics, and high-performance computing systems. The market implications include increased efficiency and reliability of electronic devices.

Questions about the technology: 1. How does the cooling structure help in preventing overheating of semiconductor components? - The cooling structure efficiently dissipates heat generated by the semiconductor component, preventing overheating and ensuring optimal performance. 2. What are the potential commercial applications of this advanced cooling system? - The technology can be applied in data centers, automotive electronics, and high-performance computing systems to enhance cooling efficiency and device reliability.

Original Abstract Submitted

an apparatus includes a semiconductor component and a cooling structure. the cooling structure is over a back side of the semiconductor component. the cooling structure includes a housing, a liquid delivery device and a gas exhaust device. the housing includes a cooling space adjacent to the semiconductor component. the liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. the gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.