There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01G4/08
Subcategories
This category has the following 14 subcategories, out of 14 total.
B
E
G
H
J
K
R
T
Y
Pages in category "H01G4/08"
The following 40 pages are in this category, out of 40 total.
1
- 18335754. METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18347938. CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND ELECTRONIC APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18367915. CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18388992. CAPACITOR COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18394644. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18463231. CAPACITOR simplified abstract (Kabushiki Kaisha Toshiba)
- 18463231. CAPACITOR simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18479452. METAL SPACER 3D-MIM CAPACITOR (International Business Machines Corporation)
- 18510787. CAPACITANCE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510973. CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18518638. METAL INSULATOR METAL (MIM) STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18522752. METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR METAL CAPACITOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18538822. WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18777112. CAPACITOR AND MANUFACTURING METHOD THEREOF (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18960876. CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT SUBSTRATE, AND DEVICE (Panasonic Intellectual Property Management Co., Ltd.)
B
I
K
P
S
- Samsung electro-mechanics co., ltd. (20250140476). CAPACITOR AND MANUFACTURING METHOD THEREOF
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on May 1st, 2025
- Samsung electronics co., ltd. (20240162278). CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING SAME simplified abstract
- Samsung electronics co., ltd. (20240213302). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240213303). CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND ELECTRONIC APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240321483). WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR simplified abstract
- Samsung electronics co., ltd. (20250006778). CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096929). METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING METAL INSULATOR METAL CAPACITOR simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240421065). METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024