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Category:G11C5/04
Subcategories
This category has the following 8 subcategories, out of 8 total.
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Pages in category "G11C5/04"
The following 43 pages are in this category, out of 43 total.
1
- 17726086. COMPUTE-IN-MEMORY DEVICE AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17947397. MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17956102. SEMICONDUCTOR MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18109338. MEMORY MODULES INCLUDING A MIRRORING CIRCUIT AND METHODS OF OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18149855. SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18403516. APPARATUS WITH DATA-RATE-BASED VOLTAGE CONTROL MECHANISM AND METHODS FOR OPERATING THE SAME simplified abstract (Lodestar Licensing Group LLC)
- 18431676. METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18515649. Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract (Apple Inc.)
- 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18622813. DUAL IN-LINE MEMORY MODULE RETAINER simplified abstract (Intel Corporation)
- 18624796. Optimize Information Requests to a Memory System simplified abstract (Micron Technology, Inc.)
- 18670778. MEMORY MODULES INCLUDING A MIRRORING CIRCUIT AND METHODS OF OPERATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18733450. PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18942874. ACCESSING ERROR STATISTICS FROM A CIRCUIT HAVING INTEGRATED ERROR CORRECTION (Texas Instruments Incorporated)
- 18946956. SEMICONDUCTOR PACKAGE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18964178. SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURE (Kioxia Corporation)
A
- Apple inc. (20240161804). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract
- Apple inc. (20250157520). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories
- Apple inc. (20250157521). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories
- Apple Inc. patent applications on May 16th, 2024
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- Micron technology, inc. (20240177743). METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron technology, inc. (20240248641). Optimize Information Requests to a Memory System simplified abstract
- Micron technology, inc. (20240258273). SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES
- Micron technology, inc. (20240258273). SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE STACKS OF DIFFERENT SEMICONDUCTOR DIES simplified abstract
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on July 25th, 2024
- Micron Technology, Inc. patent applications on March 6th, 2025
- Micron Technology, Inc. patent applications on May 30th, 2024
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- Samsung electronics co., ltd. (20240312491). MEMORY MODULES INCLUDING A MIRRORING CIRCUIT AND METHODS OF OPERATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321842). PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SK hynix Inc. patent applications on January 18th, 2024