Taiwan semiconductor manufacturing company, ltd. (20250070094). SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chao-I Wu of Hsinchu County (TW)

Yu-Ming Lin of Hsinchu City (TW)

Sai-Hooi Yeong of Hsinchu County (TW)

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250070094 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

a semiconductor package includes a processor die, a storage module and a package substrate. the storage module includes an array of cache units and an array of memory units stacked over one another, and electrically connected to the processor die, wherein the array of cache units is configured to hold copies of data stored in the array of memory units and frequently used by the processor die. the package substrate is on which the processor die and the storage module are disposed.