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Category:G06F119/18
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This category has the following 28 subcategories, out of 28 total.
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Pages in category "G06F119/18"
The following 49 pages are in this category, out of 49 total.
1
- 18434345. SEMICONDUCTOR PROCESS TECHNOLOGY ASSESSMENT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18485876. APPARATUS AND METHODS FOR PREDICTING DIE SLIDING DURING A HOT FORMING PROCESS AND ASSOCIATED HOT FORM DIE (THE BOEING COMPANY)
- 18498172. LASER WELDED BLANK WELD SEAM SAFETY DETERMINATION METHOD (FCA US LLC)
- 18535103. HYBRID MODELING FOR FILM METROLOGY (Tokyo Electron Limited)
- 18570222. DEVICES AND METHODS INVOLVING SEMICONDUCTING MATERIAL(S) FOR PHOTOCATHODES simplified abstract (The Board of Trustees of the Leland Stanford Junior University)
- 18617946. ELECTRONIC DEVICE SUPPORTING MANUFACTURE OF SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18668922. BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669864. AUTOMATED SYSTEM AND METHOD FOR CIRCUIT DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18672083. METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675815. INTEGRATED CIRCUIT AND METHOD OF FORMING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18749111. Hybrid Node Chiplet Stacking Design simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18814426. MASK OPTIMIZATION FOR FIRST LAYER THAT ACCOUNTS FOR OTHER LAYERS (D2S, Inc.)
- 18814429. MASK OPTIMIZATION FOR LAYER BASED ON COMPARISON OF COMPONENTS IN LAYER TO COMPONENTS IN OTHER LAYERS (D2S, Inc.)
- 18814432. MASK OPTIMIZATION ACCOUNTING FOR MORE CRITICAL AND LESS CRITICAL OVERLAP REGIONS (D2S, Inc.)
- 18903527. OPTIMIZATION METHOD FOR LAYERING SCHEME OF MULTILAYER INJECTION MOLDING (Zhejiang University)
- 18934812. METHOD AND DEVICE WITH IN-FAB WAFER YIELD PREDICTION (Samsung Electronics Co., Ltd.)
- 18984230. PUF CELL ARRAY, SYSTEM AND METHOD OF MANUFACTURING SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
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- Samsung electronics co., ltd. (20250094680). ELECTRONIC DEVICE SUPPORTING MANUFACTURE OF SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE
- Samsung electronics co., ltd. (20250148174). METHOD AND DEVICE WITH IN-FAB WAFER YIELD PREDICTION
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20240311543). INTEGRATED CIRCUIT AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312838). METHOD AND IC DESIGN WITH NON-LINEAR POWER RAILS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240330564). SEMICONDUCOTR DEVICE HAVING POWER RAIL WITH NON-LINEAR EDGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250124209). PUF CELL ARRAY, SYSTEM AND METHOD OF MANUFACTURING SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 17th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240176944). SEMICONDUCTOR PROCESS TECHNOLOGY ASSESSMENT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240256751). STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES
- Taiwan semiconductor manufacturing company, ltd. (20240256751). STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240303409). AUTOMATED SYSTEM AND METHOD FOR CIRCUIT DESIGN simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304533). BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240338507). Hybrid Node Chiplet Stacking Design simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- The boeing company (20250124183). APPARATUS AND METHODS FOR PREDICTING DIE SLIDING DURING A HOT FORMING PROCESS AND ASSOCIATED HOT FORM DIE
- THE BOEING COMPANY patent applications on April 17th, 2025