18814426. MASK OPTIMIZATION FOR FIRST LAYER THAT ACCOUNTS FOR OTHER LAYERS (D2S, Inc.)
MASK OPTIMIZATION FOR FIRST LAYER THAT ACCOUNTS FOR OTHER LAYERS
Organization Name
Inventor(s)
Donald Oriordan of Sunnyvale CA (US)
Akira Fujimura of Saratoga CA (US)
MASK OPTIMIZATION FOR FIRST LAYER THAT ACCOUNTS FOR OTHER LAYERS
This abstract first appeared for US patent application 18814426 titled 'MASK OPTIMIZATION FOR FIRST LAYER THAT ACCOUNTS FOR OTHER LAYERS
Original Abstract Submitted
Some embodiments provide a method for optimizing a mask layout for producing masks that are used for manufacturing an integrated circuit (IC) comprising multiple layers of components. The method receives a mask layout including a set of mask images corresponding to a first layer of components of the IC that is adjacent to at least a second layer of components. The method generates a first wafer image including representations of IC components that are predicted to be manufactured for the first layer based on the received set of mask images corresponding to the first layer. Based on a positional relationship between at least one predicted IC component in the first wafer image and at least one predicted IC component in a second wafer image for the second layer, the method modifies at least one mask image in the set of mask images for the first layer.