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Category:CPC H01L27/1207
Pages in category "CPC H01L27/1207"
The following 33 pages are in this category, out of 33 total.
1
- 18452682. NANOSHEET BASED EXTENDED-GATE DEVICE INTEGRATION (International Business Machines Corporation)
- 18488916. SYNAPTIC ARRAY STRUCTURE BASED ON CMOS INTEGRATION TECHNOLOGY AND METHOD OF FABRICATING THE SYNAPTIC ARRAY STRUCTURE simplified abstract (SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION)
- 18653473. SEMICONDUCTOR STRUCTURE INCLUDING SECTIONED WELL REGION simplified abstract (GlobalFoundries U.S. Inc.)
I
- International business machines corporation (20240413164). PASSIVE DEVICE WITH THINNER Si LAYER
- International business machines corporation (20250072116). NANOSHEET BASED EXTENDED-GATE DEVICE INTEGRATION
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on December 12th, 2024
- International Business Machines Corporation patent applications on February 27th, 2025
M
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent Application Trends in 2025
- Semiconductor Energy Laboratory Co., Ltd. Patent Application Trends in 2025
- STMicroelectronics (Rousset) SAS Patent Application Trends in 2025
T
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240203998). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250006742). STACKED MULTI-GATE DEVICE WITH LOW CONTACT VIA RESISTANCE AND METHODS FOR FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250063821). MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on January 2nd, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024